Joint Israel–Chips JU R&D Programs in Semiconductor Technologies (2026)
Open Date:
26/03/2026Phase I:
27/05/2026EndedDeadline for Submission:
23/09/2026Time zone:
Israel
Summary:
This call invites the submission of proposals for the implementation of joint research and development (R&D) programs within the framework of the Chips Joint Undertaking, in collaboration with partners from countries participating in this sub-program in the field of semiconductor technologies.
This call is carried out per the Procedure for the Implementation of International Agreements related to the European Framework Program (hereinafter: the “ISERD Procedure“) and to the provisions of the Innovation Authority’s Benefits Program Applied Research Consortia – Applied Research Fund, as specified in the ISERD procedure.
Target Audience
Program Description
Applicants intending to submit proposals to one or more of the Chips Joint Undertaking (Chips JU) calls listed below are also required to submit a corresponding application to the Innovation Authority, in accordance with the provisions of this call for proposals.
Israeli applicants must submit proposals to the Chips JU program in collaboration with partners from other countries participating in the relevant sub-program, as specified in the calls referenced above.
Please note that the list of sub-program calls is subject to updates, and additional Chips JU calls may be published from time to time.
List of Applicable Areas within the Chips JU Framework
The following areas within the Chips Joint Undertaking (Chips JU) sub-program are open to participation by Israeli applicants:
Electronic Components and System (ECS):
- Global IA call according to SRIA 2026 – Two-stage call page 12
- IA Resilience – One-stage call page 25
- Call for Reinforcing Europe’s strength in photonics – One-stage call page 32
- Call for Reinforcing Europe’s strength in health – One-stage call page 37
- ECS GLOBAL RIA – Two stage call page 53
Chips for Europe initiative (CEI):
- Quantum Chips Design: Driving Europe’s Quantum Design Ecosystem and Enabling Quantum Design Tools Innovation – One-stage call page 38
- Quantum Chips: Enabling Technologies – One stage call page 44
Please note that the list of sub-program calls may be updated and that additional Chips JU program calls may be added from time to time.
Financing
The grant awarded to an approved Israeli participant will be determined as follows:
(a) the funding rate approved for the Israeli participant by the relevant sub-program administrator; or
(b) a supplementary funding rate provided by the Innovation Authority to complement the rate approved by the sub-program administrator—whichever is lower—up to the maximum funding rate permitted for the respective type of participant under the applicable benefits program.
The maximum combined funding rates (Innovation Authority and Chips JU administrator) are as follows:
- Industrial corporations: up to 66%
- Academic institutions: up to 80%
The total budget allocated by the Innovation Authority for all approved Israeli participants under this call for proposals for 2026 is EUR 3.5 million. This allocation does not constitute a commitment to award the full amount, in whole or in part.
Implementation Period
The project implementation period will be determined in accordance with the provisions set by the relevant sub-program administrator.
Criteria
Minimum Requirements
The Innovation Authority’s minimum requirements are detailed in the procedure for implementing international agreements related to the European Framework Program.
Further information regarding the conditions of the European program can be found in the sub-programs Submitters’ Guide (pay particular attention to pages 3-6).
Application Evaluation Criteria
The criteria for evaluation by the Innovation Authority are detailed in the procedure for implementing international agreements related to the European Framework Program.
The criteria for evaluation by the European Sub-Program Administrator are detailed in the following links under Scores and Award criteria:
Submitters’ Guide to the Electronic Components and Systems (ECS) of the sub-program.
Chips for Europe initiative (CEI) submitters’ guide for the sub-program.
Application Process
Applications under this call for proposals will be submitted and evaluated through two parallel channels: in Europe and in Israel.
Submission to the Innovation Authority
Applications to the Innovation Authority must be submitted via the applicant’s personal area on the Innovation Authority website.
- Two-stage calls (first phase):
Applications must be submitted by 27 May 2026 at 12:00 noon (Israel time). - Single-stage calls:
Applications must be submitted by 23 September 2026 at 12:00 noon (Israel time).
Detailed guidance on the application process and required submission forms is available on the Innovation Authority’s Benefits Program Applied Research Consortia – Applied Research Fund.
Second Phase Submissions (Two-Stage Calls)
- No changes to the proposal:
Submitters must provide a copy of the full proposal submitted in Europe alongside a statement regarding the tasks and budgets between the preliminary proposal and the full proposal by September 23, 2026, at 12:00 noon (Israel time). - With changes to the proposal:
Submitters must provide an updated application, a copy of the full European proposal, and a detailed explanation of the changes by 23 September 2026 at 12:00 noon (Israel time). - New participants added in the second phase:
Applicants not included in the first phase must submit a full application (as required for the first phase), along with the full European proposal, by 23 September 2026 at 12:00 noon (Israel time).
Additional Notes:
- Additional deadlines may be introduced if further Chips JU calls are included in this call for proposals.
- Applications submitted by each deadline will be evaluated comparatively, per the allocated budget.
- Only complete and properly submitted applications, including all required documentation, will be considered.
- Applicants seeking confirmation of successful submission are encouraged to apply ahead of the deadline.
- Technical support is available Sunday–Thursday until 16:30 (Israel time).